Wafer Flatness Measurement System
NAPSON: WAFER FLATNESS MEASUREMENT SYSTEM
FLA-200 Wafer Flatness Measurement System
- Multi-point, Non-Contact Type using Eddy current method
- Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)
- Measures materials that include Si, GaAs, Ge, InP, SiC
- 500um thickness measurement range without re-calibration
- 2-D /3-D Mapping software
- Sample Size: Ø 3” to Ø 8”
- Measure Range:
- Thickness: 200um to 1,200um
- Bow: ± 350um
- Warp: 350um
Datasheet Download:
Technical Notes Download:
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