Products

• HPPI ATS8000 series Automated Test Systems are fully automated, dynamic flexible pitch 2-pin or fixed pitch Kelvin-type probing solution for HBM, TLP, VF-TLP, HMM and CC-TLP for package- and wafer-level
• Probe force sensors: Defined Overdrive, Automatic Touch Down; ensure good contact and minimize probe overstress, thus maximize probe tip life time
• Ultra-fast needle force touch-down sensors at mN force precision with automatic probe arm and needle crash avoidance system

CCTLP-DC, CC-TLP Probing System with DC Test:

• CC-TLP Probing System with DC Test; optimized to be used on ATS-8300G 320mm Automated Test System.
• The probing system consists of 3 probe arms; CC-TLP probe (left), Lift-off DC probe (left) and DC probe (right)

PHD-3001A-FS, GGB Model 10 Force Sensor Probe Arm Kit:

• Pulse force and pulse sense fixed pitch probing solution for TLP/VF-TLP/HMM on wafer- and package-level using GGB’s Picoprobe™ Model 10 probe tips on HPPI Automated Test Systems
• Probe tip touch down force sensors at mN resolution

HP-T26A High Performance TLP Probe Kit:

• 26 GHz high performance pulse force and pulse sense fixed pitch probing solution for advanced VF-TLP/TLP on-wafer measurements using MPI’s T26A probes
• Optimized to be used on the ATS-8300G automated test system.

Datasheet Download:

• HPPI DS ATS8000A Automated Test System
• HPPI DS ATS8000G Automated Test System
• HPPI DS ATS8300G Automated Test System
• HPPI DS CCTLP-DC CC-TLP ProbeArm
• HPPI DS PHD3001A-FS Force-Sensor ProbeArm
• HPPI DS HP-T26A High Performance TLP ProbeKit

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